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Meeting 2022 TMS Annual Meeting & Exhibition
Symposium Recent Advances in Printed Electronics and Additive Manufacturing: 2D/3D Functional Materials, Fabrication Processes, and Emerging Applications
Sponsorship TMS Functional Materials Division
TMS: Thin Films and Interfaces Committee
Organizer(s) Pooran Joshi, Oak Ridge National Laboratory
Rahul Panat, Carnegie Mellon University
Yong Lin Kong, University of Utah
Tolga Aytug, Ornl
Konstantinos Sierros, West Virginia University
Changyong Cao, Michigan State University
David Estrada, Boise State University
Nuggehalli M. Ravindra, New Jersey Institute of Technology
Scope Additive manufacturing and direct-write printed electronics technologies employing metal, dielectric, polymer, and ceramic materials have the potential to enable new products and markets. The proposed symposium will focus on the emerging additive manufacturing concepts and techniques for the processing of 2D/3D structures. Technical sessions will focus on processing and characterization of active and passive functional components integrated on engineered geometries. Topics related to functional materials, low-temperature processing, large area manufacturing, and electronic applications are within the scope of this symposium. Invited and contributed papers will discuss both the fundamental aspects underlying certain applications and the particular challenges regarding technology, fabrication processes, and reliability.

Research fields of interests are related but not necessarily limited to the following topics:
- Direct-write printing and additive manufacturing of functional 2D/3D structures and geometries: Materials, Processes, and Characterization
- Nanomaterials, inks, and substrates for direct-write printing and additive manufacturing
- Nanostructured materials for solid-state and electrochemical energy storage devices (batteries and supercapacitors)
- Low thermal budget processing and characterization of functional inks and 2D/3D materials
- Hybrid electronics: Merging printed electronics and additive manufacturing (Materials and Process integration to realize active/passive sensors, detectors, TFTs, antennas, PVs, batteries, Supercapacitors)

Abstracts Due 07/01/2021
Proceedings Plan Planned: TMS Journal: Journal of Electronic Materials
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE
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