| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Additive-induced Crystallization of Highly (111) Textured Cu Nanotwins by Electroless Deposition |
| Author(s) |
Po Shao Shih, Jeng Hau Huang, C. Robert Kao |
| On-Site Speaker (Planned) |
Po Shao Shih |
| Abstract Scope |
High-density Cu nanotwins in columnar grains were successfully fabricated within an electroless-deposited Cu film using a formaldehyde-based electroless plating solution. Such a structure was achieved using a standard electroless plating process without high-speed stirring. Additives within the plating bath induced the crystallization of the nanotwinned structure in the reduced Cu atoms. This study reports the formation and characterization of highly nanotwinned Cu with a strong (111) preferred orientation in a 3 μm electroless deposit. In addition, the deposited Cu nanotwins comprised as high as 87% of the (111) textured orientation. The prerequisite of developing a highly nanotwinned structure is speculated to be the contribution of a specific additive in the electroless plating bath. Possible mechanisms are also proposed in this study. The characteristics of the (111)- oriented Cu nanotwins and the advantages of the electroless deposition process indicate that this method is promising for future applications in the electronics industry. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Additive Manufacturing, Characterization |