| About this Abstract |
| Meeting |
Materials Science & Technology 2020
|
| Symposium
|
Micro- and Nano-Mechanical Behavior of Materials
|
| Presentation Title |
Characterization of Electroless Copper Deposits on Electrospun PAN Fibers in Aligned and Random Configurations |
| Author(s) |
Temitope Q. Aminu, Molly Brockway, Jack Skinner, David Bahr |
| On-Site Speaker (Planned) |
Temitope Q. Aminu |
| Abstract Scope |
We have electrolessly deposited copper on random and aligned PAN fibers utilizing silver nanoparticles as catalytic seeds. Fiber sizes ranges from diameters of hundreds of nanometers to a few microns. Prior work has established that coating conformity is strongly modulated by density of catalytic seeds.
We investigate the changes in the chemistry of the fibers due to the exposure to the electroless plating solutions using Raman spectroscopy. In addition, tensile tests are carried out on the metallized aligned fibers at distinct strain levels to investigate possible delamination events. Previous strain-to-failure tests on conformally coated, randomly aligned fibers mats showed good adhesion of the copper particles on the fibers. In parallel, we examine the mechanical behavior of the metallized fibers under equi-biaxial stress state utilizing a novel “leaky” bulge testing system, and demonstrate the links between the mechanics of coated fiber mats in aligned and random configurations. |