About this Abstract |
Meeting |
2021 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2021)
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Symposium
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Special Session
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Presentation Title |
High Resolution, High Conductivity Components by Aerosol Jet Printing and Electrodeposition |
Author(s) |
Lok-kun Tsui, Ste-Ven Chase Kayser, Judith Maria Lavin |
On-Site Speaker (Planned) |
Lok-kun Tsui |
Abstract Scope |
Aerosol jet printing (AJP) can be used to print high resolution features with linewidths as low as 10 um. However, Ag nanoparticle inks used in AJP have low conductivity (~14%) when compared to bulk metal. Thicker layers may be printed to compensate for this low conductivity, but at the cost of print time and resolution. We have used electrodeposition to plate a highly conductive dense film using an aerosol jet printed component as a seed layer. An acid CuSO4 plating bath was used in a 2-electrode configuration with a Cu anode to deposit a dense layer of Cu onto printed Ag. This allowed for a decreased trace resistance of over 100-fold for transformer components and multi-level interconnects. This hybrid electrodeposition/AJP process offers the best of both processes: high resolution patterning and high conductivity. SNL is managed and operated by NTESS under DOE NNSA contract DE-NA0003525 |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |