| About this Abstract |
| Meeting |
Materials Science & Technology 2020
|
| Symposium
|
Manufacturing and Processing of Advanced Ceramic Materials
|
| Presentation Title |
Processing and Properties of High Thermal Conductive Silicon Nitride Ceramics |
| Author(s) |
Kiyoshi Hirao, You Zhou, Hideki Hyuga, Tatsuki Ohji |
| On-Site Speaker (Planned) |
Kiyoshi Hirao |
| Abstract Scope |
Silicon nitride has attracted much attention as advanced insulating substrates for next-generation high out-put power module because of its excellent mechanical properties with intrinsic high thermal conductivity. So far extensive research works have been carried out for increasing thermal conductivity without degrading the mechanical properties. Our group has succeeded in fabricating high thermal conductive silicon nitrides by nitriding Si powder compacts with sintering additives, followed by post sintering process. In this presentation processing strategy for improving thermal conductivity in silicon nitride is discussed in terms of decreasing impurity oxygen dissolved in beta-Si3N4 grains, so-called lattice oxygen, and mechanical (strength , fracture toughness and R-curve behavior), thermal (temperature dependence of thermal conductivity and coefficient of thermal expansion), and electrical (dielectric breakdown voltage) properties are introduced. |