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Meeting 2021 TMS Annual Meeting & Exhibition
Symposium Metal-Matrix Composites: Advances in Analysis, Measurement and Observations
Presentation Title In situ Atomic Study of Spontaneous Nanocrystallization of Intermetallic for Interconnection of High-power and Flexible Electronics
Author(s) Ying Zhong, Chunqing Wang, Sungho Jin
On-Site Speaker (Planned) Ying Zhong
Abstract Scope A new phase-transformation-induced path to spontaneous formation of extreme nanograin structure is reported. In-situ-heating-mode-microscopy exhibited a substantial grain-growth of Cu6Sn5. During cooling, the grain-growth continued, but it spontaneously switched to grain-refinement mode on phase transformation through ~180 C from η-Cu6Sn5 to η’-Cu6Sn5, ending up with an extremely small nanograin size of ~2.5 nm. The cooling cycling always restores the nanograin size regardless of thermal exposure history, making this to be the first demonstration to stabilize the nanograin with its own spontaneous behavior. The Young’s Modulus was significantly reduced by ~3, and the elongation was remarkably increased by ~8 to ~9%. Nano-Cu6Sn5 interconnection can be obtained at lower temperature than the working temperature, preventing the damage of the flexible substrates and supporting high-power electronics. This work will also inspire other researchers to create many additional sub-4 nm type nanocrystalline intermetallicsand more interesting functions which were difficult to gain before.
Proceedings Inclusion? Planned:
Keywords Joining, Characterization, Phase Transformations


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In situ Atomic Study of Spontaneous Nanocrystallization of Intermetallic for Interconnection of High-power and Flexible Electronics

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