About this Abstract |
Meeting |
2021 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2021)
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Symposium
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Process Development
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Presentation Title |
Improving the 3D Printed Bond Strength at a Discrete Interface Between Dissimilar Materials |
Author(s) |
Chad Duty, Justin Condon, Tyler Smith, Alexander Lambert, Seokpum Kim, Vlastimil Kunc |
On-Site Speaker (Planned) |
Chad Duty |
Abstract Scope |
The majority of extrusion-based 3D printing technologies make use of a single material. However, more complex applications require the deposition of multiple materials that often have different processing conditions or material properties. The bond between these materials typically occurs at a discrete interface between adjacent rows or successive layers in a 3D printed structure. A z-pinning approach has previously demonstrated improved mechanical properties for a single material system by extruding material into an existing void that spans multiple layers in a printed structure. The current research extends this concept to the printing of multi-material structures, where a material with a lower processing temperature is deposited on previous layers of a higher melt polymer. The geometry and spacing of the z-pins that cross the interface are varied to improve the bonding strength between the two materials by more than an order of magnitude. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |