|About this Abstract
||2021 TMS Annual Meeting & Exhibition
||Recent Advances in Functional Materials and 2D/3D Processing for Sensors, Energy Storage, and Electronic Applications
||Modeling of Rheological Properties of Metal Nanoparticle Conductive Inks for Printed Electronics
||Patrick Dzisah, Nuggehalli M. Ravindra
|On-Site Speaker (Planned)
The ever-growing demand for low-cost, environmentally-friendly and flexible wireless devices has set the stage for Inkjet-printing technology as the alternative to conventional fabrication techniques such as etching and milling.
Conductive inks enable digital printing of electronic components and circuits in applications where extremely fine lines are required, such as OLED panels, solar cells, printed antennae and touch panels. In sensor and circuit designs, conductive traces on substrates can only be formed by using a conductive ink and hence open the door further research opportunities.
This work focuses on exploring the techniques and possible material candidates for conductive ink development with the aim of improving or enhancing the conductive natures of the conductive ink. Factors influencing the surface interaction between conductive ink and flexible substrates such as paper are also discussed.