About this Abstract |
Meeting |
Materials Science & Technology 2020
|
Symposium
|
Additive Manufacturing: Materials, Alloy Development, Microstructure and Properties
|
Presentation Title |
Process and Characterization of 3D-printed Copper |
Author(s) |
Tawfiq Shamsudeen, Schuyler Mann, Leo Santala, David Betolatti, Louis Pate, Jose Alarcon, Michael Bianco, Ping-Chuan Wang |
On-Site Speaker (Planned) |
Tawfiq Shamsudeen |
Abstract Scope |
Additive manufacturing (AM) of metal structures is emerging as a potentially revolutionary technique, offering many research opportunities to investigate fundamental materials science and limitations. A project of fabricating copper structures using regular consumer-grade 3D printers is currently ongoing at SUNY New Paltz, adopting injection molding techniques with filament consisting of 90% copper powder and 10% polylactic acid (PLA) as a binder. Subsequent heat treatments are conducted to (1) remove PLA from the green state (debinding), and (2) densify the loosely packed copper particles for mechanical strength (sintering). In the first section of the paper, the considerations and challenges throughout the project will be identified along with the feasibility demonstration. Secondly, the design and implementation of a heat treatment system to achieve proper densification will be presented. Lastly, results of the microstructure characterizations will be summarized to illustrate the processing-structure-property relationship of copper specimens using AM techniques. |