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About this Symposium
Meeting 2021 TMS Annual Meeting & Exhibition
Symposium Electronic Packaging and Interconnections 2021
Sponsorship TMS Functional Materials Division
TMS: Electronic Packaging and Interconnection Materials Committee
Organizer(s) Mehran Maalekian, Materials & Metallurgy Expertise
Christopher M. Gourlay, Imperial College London
Babak Arfaei, Ford Motor Company
Praveen Kumar, Indian Institute of Science
Sai Vadlamani, Intel Corporation
Kazuhiro Nogita, University of Queensland
David P. Yan, San Jose State University
Scope Continuing advances in microelectronic, optoelectronic and nanoelectronic devices require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current researches in packaging materials and processes, including Pb-free solders, microstructure-design, alternative interconnects, conductive adhesive, epoxy, 3D packaging, wafer level packaging, reliability, and root cause analysis.

Topics of interest include, but are not limited to:
* Advanced packaging materials and processes, e.g., 3D packaging, wafer level packaging, photonic packaging, Internet of Things (IoT), flexible electronics, wire bonding, automotive and power electronics
* Interconnects for packages, e.g., Pb-free solder, micro bumps, through-silicon-vias (TSVs), direct Cu to Cu bonding, wire bonding, conductive adhesive, transient liquid phase bonding, sintered nano powder joints, optoelectronic interconnects, and alternative interconnect materials at chip and package levels
* Additive manufacturing and 3D printing for electronics industry
* Other packaging materials, e.g., epoxy, molding compounds, epoxy flux, thermal interface material (TIM), and substrate materials
* Reliability and failure analysis for next generation packages
* Continuing challenges in implementing Pb-free solders for interconnect, plating and thermal interface material (TIM) applications
* Developments in next-generation Pb-free solders for improved reliability
* Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics
* Developments in low temperature Pb-free solder alloys and fine pitch solder joints
* Electromigration, thermomigration, stress-migration and mechanical effects
* Whisker growth in Sn, Sn-based alloys and other metallic systems
* Advanced characterization methods as applied to interconnect technology
* Fundamental materials behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, corrosion, mechanical, thermal, and electrical properties of solders and intermetallic compounds

Abstracts Due 07/20/2020
Proceedings Plan Planned:

Advances in Low Temperature/Low Pressure Ag Sinter Joining and Its Thermal Performance
Atomic Insights into the Role of Dopants in η-Cu6Sn5 toward Its Structural Stability
Comparison of Corrosion for Ni- and Co-based Surface Finishes
Corrosion Behavior of Co-based Surface Finishes in Sulfur-containing Gas
Development of Near Room Temperature Solder Alloys and Soldering Processes in Microelectronics
Direct Bonding Process of (111) Nanotwinned Copper Thin Films
Effect of Annealing on Mechanical Properties of nt-Cu Lines in Fan-out Wafer Level Packaging
Effect of Current Stress on the Microstructure of SnBiAg-SAC Mixed Solder Joints
Effects of Antimony on the Microstructure and Reliability of Sn-Ag-Cu-based Solder Joints
Electric-enhanced Sintering of Copper Interconnects
Electromigration of Cu-Cu Bonds Fabricated by Instant Bonding Using <111>-oriented Nanotwinned Cu Microbumps
Enhancement on the Bonding Strength of Instantly-bonded Cu-Cu Joints by Post Annealing
Finite Element Analysis Modeling of Stress Evolution and Whisker Growth Under Applied Pressure
High Electromigration Resistance of Nanotwinned Cu Redistribution Lines for Fan-out Packaging
Influence of Indium on the Microstructure and Properties of Interfacial IMC in Sn-rich Solder Joints: Experiments and First Principle Calculations
Interfacial Reaction of Ni-In System and Mechanical Properties of Ni3In7
Investigation of Interdiffusion In Micro Solder Joint with a Fine Pitch Copper Pillar Subjected to Electromigration Stressing
Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating Using Microfluidic System
Low Temperature Cu Direct Bonding with (111)-oriented Nanotwinned Copper Films on Metal Substrates
Microalloying Effects on Intermetallic Compound Growth and Mechanical Reliability of Sn-Bi Solder Joints
Microstructural Evolution in Low-temperature Pb-free Solders
Modeling and Simulation of Stress Gradient Driven Migration
Modeling Effect of Copper Solute on Electromigration Induced Stress Generation in Al-based Interconnects
Nucleation and Growth Kinetics of Sn Whiskers Under Applied Pressure
On Interface Formation in Zr-based BMG /6061 Al Interconnects Joined by µFSSW
On the 3D Evolution of the Nanoporous Structure of Sintered Ag on a Cu Substrate During Isothermal Aging Observed by In-situ X-ray NanoTomography
Plasticity and Contact Resistance Behavior in Wirebond Packaging
Real-time Observation of the Accelerated Growth of (Cu,Ni)6Sn5 on Cu-xNi
Reconciling Phase Equilibria and Crystal Structures for the Cu6Sn5 Intermetallic in the Cu-Sn System
Reducing Cracking in BGA Solder Joint Cu6Sn5 by Controlling the Reflow Profile
Reliability Evaluation of Ag Sinter-joining Die Attach under a Harsh Thermal Cycling Test
Single Solder Joint Shear with In-situ Current Stressing
Sintered Micro-silver Joints with the Addition of Indium Applied to Power IC Packaging
Sn-Ag-Cu and Sn-Bi Solder Powders for Fine Pitch Printing
Solderability Assessment of Lead-free Alloys
Tailoring βSn Grain Orientations in Electronic Interconnections via Manipulating Textures of Interfacial Intermetallics
The Effects of DC, Pulsed DC, and AC Load Conditions on Electromigration Failure Mechanism in Solder Interconnects
The Formation and Growth Kinetics of a Peculiar Cu6Sn5/Ag3Sn Composite Intermetallic Layer at the Cu50Ag/Sn Interface during Solid-state Aging

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