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About this Symposium

Meeting 2027 TMS Annual Meeting & Exhibition
Symposium Additive Manufacturing Modeling, Simulation, and Artificial Intelligence: Microstructure, Mechanics, and Process
Sponsorship TMS Materials Processing and Manufacturing Division
TMS: Additive Manufacturing Committee
TMS: Integrated Computational Materials Engineering Committee
Organizer(s) Jing Zhang, Purdue University
Li Ma, Johns Hopkins Applied Physics Laboratory
Charles R. Fisher, Office of Naval Research
Brandon A. McWilliams, US Army Research Laboratory
Yeon-Gil Jung, Changwon National University
Scope This long-established symposium will provide an excellent platform to exchange the latest knowledge in additive manufacturing (AM) modeling, simulation, and artificial intelligence/machine learning (AI/ML). Despite extensive progress in the AM field, many challenges in predictive, theoretical, and computational approaches still hinder the advancement of AM technologies.

The symposium is interested in receiving contributions in the following non-exclusive areas:
1.      Modeling of microstructure evolution, phase transformation, and defect formation in AM parts
2.      Modeling of residual stress, distortion, plasticity/damage, creep, and fatigue in AM parts
3.      Machine learning (ML), artificial intelligence (AI), data science (DS), and uncertainty quantification (UQ) applications to AM
4.      AM process monitoring and defect quantification for model verification and validation

Abstracts Due 07/15/2026
Proceedings Plan Planned: Supplemental Proceedings volume

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