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About this Symposium

Meeting 2027 TMS Annual Meeting & Exhibition
Symposium Additive Manufacturing Modeling, Simulation, and Artificial Intelligence: Microstructure, Mechanics, and Process
Sponsorship
Organizer(s) Jing Zhang, Purdue University
Li Ma, Johns Hopkins Applied Physics Laboratory
Charles R. Fisher, Office of Naval Research
Brandon A. McWilliams, US Army Research Laboratory
Scope This long-standing symposium will provide an excellent platform to exchange the latest knowledge in additive manufacturing (AM) modeling, simulation, and artificial intelligence/machine learning (AI/ML). Despite extensive progress in the AM field, many challenges in predictive, theoretical, and computational approaches still hinder the advancement of AM technologies. The symposium is interested in receiving contributions in the following non-exclusive areas: In particular, the following topics, but not limited to, are of interest:

1. Modeling of microstructure evolution, phase transformation, and defect formation in AM parts
2. Modeling of residual stress, distortion, plasticity/damage, creep, and fatigue in AM parts
3. Machine learning (ML), artificial intelligence (AI), and data science (DS) applications to AM
4. Calibration and validation data sets relevant to models
5. AM process monitoring and defect quantification
6. Efficient computational methods using reduced-order models or fast emulators for process control
7. Multiscale/multiphysics modeling strategies, including any or all of the scales associated with the spatial, temporal, and/or material domains

Abstracts Due 07/01/2026
Proceedings Plan Planned: Supplemental Proceedings volume

PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

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