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About this Symposium

Meeting MS&T26: Materials Science & Technology
Symposium Joining/Bonding of Dissimilar Materials
Sponsorship ACerS Basic Science Division
TMS: Process Technology and Modeling Committee
TMS: Thin Films and Interfaces Committee
Organizer(s) Rodney W. Trice, Purdue University
Gregory B. Thompson, University of Alabama
Judy Schneider, University of Alabama at Huntsville
Monica Ferraris, Politecnico di Torino - Italy
Evan Schwind, University of Alabama
Scope The symposium aims to facilitate the exchange of fundamental knowledge and technological advancements in joining and bonding dissimilar materials. These materials include, but are not limited to, metals, ceramics, and ceramic matrix composites such as carbon-carbon, SiC-based, and oxide-based composites.

A particular focus is given to integration strategies for metals and advanced materials, including challenges associated with joining metals to ceramics, polymers, and composites. Topics of interest include joint and interface design, strategies to mitigate thermal expansion mismatch, joining process approaches, simulations of coefficient of thermal expansion mismatch, as well as testing and characterization.

Joining and bonding techniques of interest include mechanical and thermomechanical methods, solid-state diffusion bonding, microwave joining, green-state joining, glass or ceramic interlayer bonding, diffusion bonding via a liquid phase, hybrid joining methods, and pre-ceramic polymer-based joints.

The symposium also welcomes contributions on advanced metallurgical bonding including brazing, transient liquid phase bonding, friction stir welding applied to dissimilar joints.

Additionally, localized heating joining methods (e.g., laser, microwave) and their industrial applications are of particular interest, especially in aerospace, automotive, energy, and biomedical sectors where metal integration plays a crucial role.

Abstracts Due 05/01/2026

PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

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