ProgramMaster Logo
Conference Tools for 2025 TMS Annual Meeting & Exhibition
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Symposium
Meeting 2025 TMS Annual Meeting & Exhibition
Symposium Solid State Diffusion Bonding of Metals and Alloys
Sponsorship
Organizer(s) Mohamed S. Elbakhshwan, University of Wisconsin Madison
Peng Wang, University of Michigan
Tate Patterson, Idaho National Laboratory
Fei Gao, University of Michigan
Todd Allen, University of Michigan
Mark Anderson, University of Wisconsin Madison
Scope Solid state diffusion bonding is a welding process that is based on the atomic diffusion across the mating surfaces to produce monolithic parts with comparable mechanical properties to those of bulk material. It is often performed at high pressures and temperatures to promote the interdiffusion process. The technique is widely used in nuclear, aerospace, petrochemical, and solar energy applications and used to join both similar and dissimilar materials and alloys. Nevertheless, the bonding process is highly sensitive to several factors, such as surface finish, temperature, pressure, and time. In some cases, low-melting interlayer is needed to promote the interdiffusion process. Bonding time is always a major factor in the process; while increasing time allows atomic diffusion to occur, it led to the precipitation of second phase particles in the matrix and grain boundaries. This symposium will focus on recent progress in the diffusion bonding processes performed in research environments, as well as on industrial scales, with special focus on:

• Optimal bonding conditions for metals and alloys.
• Changes in the mechanical properties in the bonded joins.
• Grain growth and microstructural evolution after the bonding process.
• Precipitation in complex alloys.
• Modeling and simulation of the diffusion bonding process.

Abstracts Due 07/01/2024
Proceedings Plan Undecided
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE
No additional information can be displayed at this time.


Questions about ProgramMaster? Contact programming@programmaster.org