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Meeting 2024 TMS Annual Meeting & Exhibition
Symposium Electronic Packaging and Interconnection Materials
Sponsorship TMS Functional Materials Division
TMS: Electronic Packaging and Interconnection Materials Committee
Organizer(s) Christopher M. Gourlay, Imperial College London
Kazuhiro Nogita, University of Queensland
Albert T. Wu, National Central University
David P Yan, San Josť State University
Praveen Kumar, Indian Institute of Science
Patrick Shamberger, Texas A&M University
Mohd Arif Anuar Salleh, Universiti Malaysia Perlis (Unimap)
Yu-An Shen, Feng Chia University
Scope Continuing advances in microelectronic, opto-electronic and nano-electronic devices require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current research in packaging materials and processes, including Pb free solders, Ag and Cu sintering, hybrid bonding, conductive adhesives, epoxy, substrates, 3D packaging, wafer level packaging, quality, reliability, and failure analysis.

Topics of interest include, but are not limited to:

* Packaging materials and processes for next generation packages, e.g., 3D packaging, wafer level packaging, photonic packaging, Internet of Things (IoT), flexible electronics, wire bonding, automotive and power electronics.
* Interconnects for packages, e.g., Pb-free solder, micro bumps, Through-silicon-vias (TSVs), direct Cu to Cu bonding, wire bonding, conductive adhesive, optoelectronic interconnects, transient liquid phase bonding, sintered nano-powder joints, polymer core solder balls and alternative interconnect materials at chip and package levels.
*Additive manufacturing and 3D printing for electronics industry
* Other packaging materials e.g., epoxy, molding compounds, epoxy flux, thermal interface material (TIM), substrate materials and process.
* Quality, Reliability, and failure analysis for next generation packages.
* Continuing challenges in implementing Pb-free solders for interconnections, plating and thermal interface material (TIM) applications
* Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics
* Developments in low temperature Pb-free solder alloys and fine pitch solder joints
* Electromigration, thermomigration, stress-migration and mechanical effects
* Whisker growth in Sn, Sn-based alloys and other metallic systems
* Advanced characterization methods as applied to interconnect technology
* Fundamental material behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, micromechanics, corrosion, mechanical, thermal, and electrical properties of solders and intermetallic compounds

Abstracts Due 07/15/2023
Proceedings Plan Planned:

A-18: Effect of Ni/Ga Ratio on Fabrication of Cu-to-Cu Joints by Using Electroplated Ga Layer and Ni UBM
A-19: Fatigue Life of Selective Laser Solder Joints of a MEMS Probe for Automotive Semiconductor Wafer Test
A-20: Self-organization Assembly Solder Resin for Fine Pitch Components Bonding Application
A-35: Wetting Kinetics and Microstructure of Micro-textured Surface Modified Copper Substrate During Soldering
Additive-induced Crystallization of Highly (111) Textured Cu Nanotwins by Electroless Deposition
Anisotropic Effects in Electromigration Enhanced Intermetallic Growth in Sn Based Solders
Annealing Effect on the Electro-recrystallization of Tin
Contribution of Ni Microalloying to the Cu Dissolution of In-35Sn/Cu Solder Joint After Multiple Reflows
Controlling Porosity During Transient Liquid Phase Soldering for Power Modules
Corrosion Induced Fracture of Cu/Al Interconnects in Microelectronics Packages
Cryogenic Mechanical Properties and Time-temperature Dependent Phase Transformations of Ultra-low Temperature In-Sn-Bi Solder Alloys
Cu-Cu Interconnection With Electroplated Ga and Ni UBM
Development of Low-temperature Cu-to-Cu Direct Bonding Technology Using Glycerol Vapor as Cu Surface Antioxidant
Effect of Epoxy Material and Gold Wire Configuration on Light-emitting Diode Encapsulation Process
Effect of Grain Size and Stress Relaxation on Whisker Growth Under Applied Pressure
Effect of Microstructure of Ag on the Growth of Intermetallic Compound in Ag-In System During Isothermal Reflow Process
Effect of Sb and Ag Addition on the Melting and Solidification of Near-eutectic Sn-Bi Solder Alloys
Effects of Sb Addition on the Mechanical Behavior of Eutectic Sn-Bi Solder Alloys
Electro-recrystallization in Pure Cu Metal Induced by Current Stressing: A Comprehensive Study of Microstructure, Crystallinity, and Properties
Electromigration Behavior of Nano-twinned Cu-Ag Alloy Thin Films
Electromigration Test of Electroless Copper Plating Interconnection
Enhancing Joint Strength and Microstructural Modification Through the Addition of Eco-friendly Nanofibers in SAC Solder
Impact of Current Induced Joule Heat Variation on Low Melting Temperature Solder Joint Stability
Impact of Microstructure on the Joule Heat Behaviors of Solder Interconnects
Improved Lifetime of an Electrophoretic Display Based on Solvent and Sealant Engineering
In-situ Characterisation of the Time-temperature Dependent Structural Changes in Sn-Bi Alloys
Interfacial Reaction Between Electroplated Indium and Copper Substrate
Interfacial Reactions Between the Molten Sn Solder and Cu-2.3Fe wt.% (C194) Substrate
Investigation of In-passivated Cu-to-Cu Direct Bonding With a Sn Diffusion Barrier Layer
Investigations of Current-induced Grain Growth and Properties Variation in Pure Ag Metal Under Extremely High Current Density
Low-temperature Direct Bonding of Co-sputtered Cu-Ag Alloy Thin Films
Low-temperature Direct Bonding of Co-sputtered Nano-twinned Cu-Ag Alloy Thin Films
Microstructural Fingerprints for Secure Microelectronic Packaging
Microstructure, Texture, and Properties Evolutions in Pure Nickel Metal Under High-density Electric Current Stressing
New Insights Into the Role of Microstructure on the Thermal Fatigue Performance of BGA Packages
Numerical Modeling the Effect of Copper Solute on Electromigration Stress Development in Al Interconnects
Phase Formation and Transformation Behavior in Rapidly Solidified Ag-Si Alloys
Reliability of Silver─tin Alloy Sintering for Power Electronic Applications
Strain-controlled High-cycle Fatigue of Solder Joints for High-reliability Environments
Surface Precipitation and Growth Mechanisms of Bismuth Particles in Sn-Bi Solder
The Conductivity and Mechanical Properties of Hybrid Carbon Black/Copper Filled Linear Low-density Polyethylene (LLDPE) and Liquid Silicone Rubber (LSR) Flexible Conductive Polymer Composites for Electronic Interconnect Applications.
The Effect of Surface Roughness on Spreading of SAC305 on Ag Substrates
The Formation of Ag Nodule Structures From Ag-Si Metastable States
The Kinetic Analysis and Inhibition Efficiency of the Anti-immersion Agent for the Ag Replacement Reaction.
The Role of FeCoNiMn as a Diffusion Barrier in Solder Joints During Thermomigration
Thermal Strain Measurement of Solder Joint in Electronic Packages
Towards Practical Demountable Joints for Fusion Devices - Microstructure Formation and its Stability in the In-Bi-Sn Ultra-low-temperature Eutectic Soldering Alloy

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