Topics of interest include, but are not limited to:

* Packaging materials and processes for next generation packages, e.g., 3D packaging, wafer level packaging, photonic packaging, Internet of Things (IoT), flexible electronics, wire bonding, automotive and power electronics.
* Interconnects for packages, e.g., Pb-free solder, micro bumps, Through-silicon-vias (TSVs), direct Cu to Cu bonding, wire bonding, conductive adhesive, optoelectronic interconnects, transient liquid phase bonding, sintered nano-powder joints, polymer core solder balls and alternative interconnect materials at chip and package levels.
*Additive manufacturing and 3D printing for electronics industry
* Other packaging materials e.g., epoxy, molding compounds, epoxy flux, thermal interface material (TIM), substrate materials and process.
* Quality, Reliability, and failure analysis for next generation packages.
* Continuing challenges in implementing Pb-free solders for interconnections, plating and thermal interface material (TIM) applications
* Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics
* Developments in low temperature Pb-free solder alloys and fine pitch solder joints
* Electromigration, thermomigration, stress-migration and mechanical effects
* Whisker growth in Sn, Sn-based alloys and other metallic systems
* Advanced characterization methods as applied to interconnect technology
* Fundamental material behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, micromechanics, corrosion, mechanical, thermal, and electrical properties of solders and intermetallic compounds