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About this Symposium

Meeting 2027 TMS Annual Meeting & Exhibition
Symposium Solid-State Processing, Microstructural Design, and Materials Innovation: A TBD/ Symposium in Honor of Prof. Rajiv S. Mishra
Sponsorship
Organizer(s) Nilesh Kumar, University of Alabama, Tuscaloosa
Indrajit Charit, University of Idaho, Idaho Falls
Nathan A. Mara, University of Minnesota
Scope This honorary symposium celebrates the pioneering contributions of Prof. Rajiv S. Mishra to the field of materials science and engineering, with special emphasis on solid-state processing, friction stir technologies, microstructural design, and materials innovation. Prof. Mishra’s work has profoundly influenced the development of friction stir welding and processing, solid-state additive manufacturing, and high-entropy and hierarchical microstructures. This symposium will provide a platform for researchers, collaborators, students, and industrial partners to share recent advances and perspectives across a wide spectrum of materials processing and design topics inspired by Prof. Mishra’s legacy.

We invite abstracts from academia, industry, and national laboratories that align with or are inspired by the scientific and technological contributions of Prof. Mishra. Contributions that integrate processing-microstructure-property relationships, innovative manufacturing strategies, and novel alloy systems are particularly encouraged.

Technical topics:
Friction stir welding and processing, Additive friction stir deposition (AFSD) and Solid-state additive manufacturing, Thermomechanical processing and microstructural evolution, Ultrafine grained and Nanostructured materials, Superplasticity and Grain boundary engineering, Hierarchical microstructures and Advanced alloy design, Compositionally complex alloys (high entropy alloys), Sustainable and recyclable materials processing, Joining of lightweight and dissimilar materials, Structure–property relationships in processed alloys, Mechanical behavior of advanced materials, Creep of dispersion strengthened materials

Abstracts Due 07/01/2026
Proceedings Plan Planned: Stand-alone book in which only your symposium’s papers would appear

PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

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