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About this Symposium

Meeting 2026 TMS Annual Meeting & Exhibition
Symposium Printed Electronics and Additive Manufacturing of Advanced Functional Materials and Devices—From Processing Concepts to Applications
Sponsorship TMS Functional Materials Division
TMS: Thin Films and Interfaces Committee
Organizer(s) Tolga Aytug, Oak Ridge National Laboratory
Pooran Joshi, Elbit Systems of America
Yong Lin Kong, Rice University
Changyong C. Cao, Case Western Reserve University
Masoud Mahjouri-Samani, Auburn University
Dave Estrada, Boise State University
Ethan B. Secor, Iowa State University
Konstantinos Sierros, West Virginia University
Scope Additive manufacturing and direct-write printed technologies employing metal, dielectric, semiconductor, polymer, and ceramic materials have the potential to enable new products and markets. Accordingly, many emerging applications in sensing, energy harvesting and storage, robotics, wearables, healthcare, aerospace, and communication necessitate electronic materials of novel form factors and unique processing approaches. The proposed symposium will concentrate on the emerging additive manufacturing concepts and printing techniques for the processing of functional thin films, low-dimensional materials, 3D architectures, and composite structures. Technical sessions will focus on fabrication methods and characterization of active and passive functional components on technological substrates as well as integrated into engineered geometries. Topics related to patterning and processing 1D/2D/3D material systems for functional applications are within scope, including advances in materials, processing technologies, or device development. Invited and contributed papers will discuss both the fundamental aspects underlying materials and process development, the correlation of material and device design and functionality, and the particular challenges and opportunities related to scalability, reliability, and sustainability.

Research fields of interest are related but not necessarily limited to the following topics:
- Direct-write printing and additive manufacturing of functional 1D/2D/3D structures and geometries: Materials, Processes, and Characterization
- Nanomaterials, inks, and substrates for direct-write printing and additive manufacturing
- Nanostructured materials for energy generation and storage devices (e.g., batteries and supercapacitors)
- Low thermal budget processing and characterization of functional inks and 1D/2D/3D materials
- Flexible/stretchable devices enabled by printed electronics (e.g., robotics, wearables, and healthcare)
- Methods and materials for printing on porous, biodegradable and water-soluble substrates
- Design and fabrication of multimaterial and multifunctional structures and devices
- Testing and quality control for qualification and standardization of printed flexible and hybrid electronics
- Hybrid electronics: Merging printed electronics and additive manufacturing (materials and process integration to realize active/passive sensors, detectors, optical and photonic devices, TFTs, antennas, PVs, batteries, supercapacitors, and large area electronics)
- Computational modeling/learning methods for predictive understanding of ink formulation, print process control and design

Abstracts Due 07/29/2025
Proceedings Plan Planned:

PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE


3D-Printable Elastomeric Silicone Pneumatic Actuators with Embedded Sensors
Additive Manufacturing for Wearable, Implantable, and In Vivo Therapeutic Applications
Additive Manufacturing of Interconnect Structures for Microelectronics Packaging Applications
Additive Manufacturing of P-N Junction Diodes on Silicon Wafer
Additive Manufacturing of Reduced Critical Rare Earth Bonded Permanent Magnets
Additively Manufactured MXene-Based Communication Devices
Additively Printed Biomass-Based Triboelectric Sensors for Self-Powered Skin-Integrated Electronics
Aerosol Jet Printed Electronic Devices and Components at Sandia National Laboratories
Analysis of Coaxial Direct Ink Writing for Embedded Sensors in Soft Robotic Applications
Bilayer Molybdenum Disulfide Strain Controlled Field Effect Transistor
Binder Jet Printing and Consolidation of Soft Magnetic Ferrites
CARBON NANOMATERIAL ENABLED ULTRA HIGHCONDUCTIVITY CU COMPOSITES
Chemistry-Centered Flexible Sensing and Actuation Systems for Advanced Human-Machine Interfaces
Closed-Loop Process Control in Polymer Large-Area Additive Manufacturing through Integrated Sensing and Data Analytics
Conductive inks sintering challenges, performances, and perspectives, for the pad printing of electronic circuit and sensors
Controllable Assembly of Nanomaterials in 3D via Printing
Development of L-DED Technology for Depositing Dissimilar Materials in Sub-Millimeter Narrow Grooves
Dry Multimaterial Printing Directly from Raw Materials
Electrically Conductive 2D MXene Carbides for Printed Electronics and Additive Manufacturing
Enhancing Capacity of Cobalt-Free Lithium-Ion Batteries via Aerosol Jet Deposited Ultra Thick Micro Architected Electrode Structures
Epitaxial nanodiamond and Q-carbon nanoballs designed structures formed by direct-laser-writing for quantum sensing
Exploring Bayesian and Taguchi optimization pathways for aerosol jet printing
Flexible Amorphous Homojunction Transistors Printed from Eutectic Liquid Metal Alloys
Flexible Wearable Biosensors for Children and Congenital Heart Disease
Functional Thin Film Material Enabled Optical Sensor Technologies in Energy and Defense Applications
High-Resolution Liquid Metal-Based Stretchable Electronics Enabled By Colloidal Self-Assembly and Micro-Transfer Printing
High-temperature annealing of direct-laser-written 3D structures for phase transformation into nanodiamond and Q-carbon
High-temperature superconductivity in direct-laser-written patterned B-doped Q-carbon structures
Hybrid 3D Printing of Liquid Metal-Polymer Architectures for Advanced Soft Electronics
Hybrid Integration of Laser-Induced Graphene and Direct-Ink-Written Silver for Flexible Electrochemical Sensors
Improved Sensitivity in Triboelectric Pressure Sensors through Aerosol Jet Printed Texturing
Ink Formulation and Process Development to Tailor Aerosol Jet Printing
Large Area Micropatterning of CdSe Nanoplatelets
Optimizing Inkless Printed Electronics with Machine Learning Models
Optimizing Printing of PEDOT:PSS for Flexible Electronics by Aerosol Jet Printing
PDMS 3D AJP: Mechanisms, Microarchitectures and Applications​
Printable Copper Materials for Flexible Hybrid Electronics
Printing Energy Storage: Direct Ink Writing of MXene Architectures for 3D Batteries and Supercapacitors
Process–Structure–Function relationships in laser-induced graphene for electrochemical sensing Applications
Radically-Accessible Approach to 3D Printing of Aluminum Alloys for Structural and Electronic Applications
Robust and Inexpensive process for DIW Printing of Conformable Electronic Circuits with Cleaner, Greener Solvents
Role of Thermal Processing Strategies on the Inter-flake Properties of Graphene-Cellulose Networks
Scalable Fabrication of 2D 1T-TiS₂ Nanosheets for High-Performance Energy Storage Applications
Scalable Fabrication of LIGMIS: Laser-Induced Graphene Microfluidic Integrated Sensors for Point-of-Need Monitoring
Side-Selective Patterning of Laser-Induced Graphene for Flexible and Implantable Devices
Surface Force-Driven Direct Ink Writing: Unconventional Deposition of Textured Thin Films
Sustainable Materials for Electrochemical Energy Storage
Towards Low-Cost Highly-Deformable and Reliable Stretchable Electronics
Towards Multiplexing Detection of Parasites with 3D Printed Funnel Adapted Sensing Tube (FAST)
Ultrasound Assisted Multi-Material 3D Printing of Flexible, Multilayered Electronic Circuit


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