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Meeting 2025 TMS Annual Meeting & Exhibition
Symposium Printed Electronics and Additive Manufacturing: Advanced Functional Materials, Processing Concepts, and Emerging Applications
Sponsorship TMS Functional Materials Division
TMS: Thin Films and Interfaces Committee
Organizer(s) Tolga Aytug, Oak Ridge National Laboratory
Pooran Joshi, Elbit Systems of America
Yong Lin Kong, Rice University
Konstantinos Sierros, West Virginia University
Masoud Mahjouri-Samani, Auburn University
Changyong Cao, Case Western Reserve University
Dave Estrada, Boise State University
Ethan B. Secor, Iowa State University
Scope Additive manufacturing and direct-write printed electronics technologies employing metal, dielectric, semiconductor, polymer, and ceramic materials have the potential to enable new products and markets. Accordingly, many emerging applications in sensing, photovoltaics, energy-harvesting and storage, robotics, wearables, healthcare, aerospace, and communication necessitate electronic materials of novel form factors and unique processing approaches. The proposed symposium will focus on the emerging additive manufacturing concepts and techniques for the processing of 2D/3D structures. Technical sessions will focus on fabrication methods and characterization of active and passive functional components on technological platforms as well as integrated into engineered geometries. Topics related to functional materials, low-temperature processing, large-area manufacturing, and electronic applications are within the scope of this symposium. Invited and contributed papers will discuss both the fundamental aspects underlying certain applications, the correlation of device performance and functionality, and the particular challenges regarding technology, fabrication processes, reliability, and sustainability.

Research fields of interest are related but not necessarily limited to the following topics:
- Direct-write printing and additive manufacturing of functional 2D/3D structures and geometries: Materials, Processes, and Characterization
- Nanomaterials, inks, and substrates for direct-write printing and additive manufacturing
- Nanostructured materials for solid-state and electrochemical energy storage devices (batteries and supercapacitors)
- Low thermal budget processing and characterization of functional inks and 2D/3D materials
- Flexible/stretchable devices enabled by printed electronics
- Methods and materials for printing on biodegradable and water-soluble substrates
- Multimaterial and multifunctional structures and devices
- Testing and quality control for qualification and standardization of printed electronics
- Hybrid electronics: Merging printed electronics and additive manufacturing (Materials and Process integration to realize active/passive sensors, detectors, optical and photonic devices, TFTs, antennas, PVs, batteries, supercapacitors, and large area electronics)
- Computational modeling/learning methods for predictive understanding of print-process control and design

Abstracts Due 07/15/2024
Proceedings Plan Undecided
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

3D electronics fabricated by synergized multimaterial printing and freeform laser induction
3D necroprinter
3D printing of composites with controlled micro/macrostructure design for electronic packaging
Additive Manufacturing of Interconnect Structures for Microelectronics Packaging Applications
Additive Manufacturing of Magnetostrictive Transducers
Additive Manufacturing of Soft Magnetic Materials: Prospects and Challenges
Aerosol Jet Printing and Optimization of PEDOT:PSS for Flexible Electronics and Soft Robots
Bilayer Molybdenum Disulfide Strain Controlled Field Effect Transistor
Binder Jet Printing of Soft Magnetic Ferrite Materials: Motivations and Progress to Date
Design of Materials for Energy Storage
Development of a Ceramic Ink for Stereolithography based 3D printing
Direct-Write and 3D Printing of Electronic Materials Enabled by Liquid Metals
Direct-Write of High Conductivity Metal Interconnects and Micro-Bumps via Confined Electrochemical Deposition
Discovery and Optimization of Conductive Nanoparticle Inks for Printed Electronics using an Autonomous Ecosystem
Enhance electrical conductivity and machinal properties of Cu-Cr alloys through Rapid Directional Solidification
Enhancing Electrical Conductivity of Laser-Induced Graphene Electrodes by Relasing and Dual-Wavelength Control
Hyper Devices: Using Aerosol Jet 3D Nanoprinting for Ultrahigh Performance Biomedical and Energy Storage Devices
Inkless Maskless 3D Printed Silicon Schottky Diodes
Laser Ablation and Sintering Enabled (LASED) Dry Printing Electronics and Functional Devices
Liquid metal printed ultraconductive transparent two-dimensional oxides for wearable bioelectrodes
Metal-MXene Composites: Enhancing Conductivity and Mechanical Properties via Advanced Processing
Micro Additive Manufacturing of Functional Hydrogels
Multimaterial Aerosol Jet Printing for Patterning Material Gradients
MXene-Based Inks for Direct Ink Writing of 3D Energy Storage Devices
Nanomaterial-based Material Extrusion: Printability and Applications
Non-subtractive, “near-net-shape” nanomanufacturing of 2D layered materials into highly-uniform “1D” nanoribbons and quantum wires
nonSLED2=SLED
Optimization of aerosol jet-printed nanomaterial thin films for enhanced sensor performance
Printed Electronics for Cultivating Plants in Space
Printing Multifunctional Hydrogel Devices with Tunable Adhesion and Stretchability for Human-Machine Interfaces
Probing Inter- and Intra-flake Contributions to Reduced Electrical Properties in Percolated Flake Networks
Radically-Accessible Approach to 3D Printing of Full-Density Aluminum Alloys
Standalone Stretchable Device Platform for Biomedicine
Thermal conductivity measurement of a thin layer of the single crystals of PMN-PT using time Domain thermoreflectance (TDTR) technique
Towards fast, efficient, and sustainable metal AM: Novel ultra-high speed regime in LPBF printing of pure copper
Ultraconductive Copper-Carbon Nanotube Composite for Advanced Conductors
Unveiling the Potential of Hybrid Additive Manufacturing for Next-Generation Functionality in Printed Electronics


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