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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Solid State Diffusion Bonding of Metals and Alloys
Sponsorship TMS Materials Processing and Manufacturing Division
TMS: Advanced Characterization, Testing, and Simulation Committee
Organizer(s) Mohamed S. Elbakhshwan, University of Wisconsin Madison
Mark Anderson, University of Wisconsin Madison
Todd Allen, University of Michigan
Tasnim Hassan, North Carolina State University
Scope Solid state diffusion bonding is a welding process that is based on the atomic diffusion across the mating surfaces to produce monolithic parts with comparable mechanical properties to those of the bulk material. It often performed at high pressures and temperatures to promote the interdiffusion process. The technique is widely used in nuclear, aerospace, petrochemical, and solar energy applications and used to join both similar and dissimilar materials and alloys.

Nevertheless, the bonding process is highly sensitive to several factors such as; surface finish, temperature, and pressure. In some cases, low-melting interlayer is needed to promote the interdiffusion process. Bonding time is always a major factor in the process; while increasing time allow atomic diffusion to occur, it led to the precipitation of second phase particles in the matrix and grain boundaries. This symposium will focus on recent progress in the diffusion bonding processes performed in research environments as well as on industrial scales, with special focus on:
1. Microstructural changes after the bonding process.
2. Changes in the mechanical properties in the bonded joins.
3. Precipitation in complex alloys.
4. Optimal bonding conditions for metals and alloys.

Abstracts Due 07/15/2019
Proceedings Plan Planned: Supplemental Proceedings volume

Anisotropic Grain Growth in Cu Joints at Low Temperatures by <111>-oriented Nanotwinned Copper Films
Bulk-state Reaction for Synthesizing Bulk Hybrid Alloys through High-pressure Torsion
Diffusion Bonding of AgC-Cu Bi-Layered Electrical Contacts
Diffusion Bonding of Ti-6Al-4V Alloy to Interstitial Free (IF) Steel Using Copper and Nickel Interlayers
Instant Copper Direct Bonding Using <111>-oriented Nanotwinned Cu Microbumps
Interfacial Recrystallization and Element Diffusion during the Hot Compression-bonding of Ti-6321 to TC4
Mechanical Characterization of Diffusion Bonded Alloy 800H
Mechanical Performance of Diffusion Bonded 316 Stainless Steel for use in a Hybrid Compact Heat Exchanger
Microstructural Characterizations and Mechanical Properties of Diffusion Bonded Stainless Steel 316H and Inconel 800H
Microstructural Evolution and Mechanical Properties of Lap-jointed Ti-6Al-4V Plates by Pin-less Friction Stir Spot Welding
Microstructure Evolution and Mechanical Properties of Diffusion Bonded Ti6Al4V Alloy Joints for Aerospace Applications
Modeling Strength of Diffusion Bonded Interface Using Phase-Field Recrystallization and Creep-Damage Models.
MTI Low Force Friction Welding
Multi-Scale Study Of Bonding Mechanism Between Immiscible Mg/Steel Alloys
O-49: Joining of 14YWT Ferritic ODS Alloys by Spark Plasma Technique
O-50: Optimization and Prediction of Bond Characteristics of Ti6Al4V Diffusion Bonded Joints through RSM
Solid-state Diffusion Bonding of Glass-metal for the International Thermonuclear Experimental Reactor (ITER) Diagnostic Windows
Solid State Joining of Dissimilar Ni-based Superalloys Using Field Assisted Sintering Technology
Tensile Performance of Diffusion Bonded Haynes 230 Alloy for use in a Compact Heat Exchanger
The Role of Interface Microstructure and Chemistry on the Bond Strength of Aluminum 6061 HIP-bonded Samples

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