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About this Symposium

Meeting 2027 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
Sponsorship TMS Functional Materials Division
TMS: Alloy Phases Committee
Organizer(s) Yu-Chen Liu, National Cheng Kung University
Hiroshi Nishikawa, Osaka University
Shih-kang Lin, National Cheng Kung University
Yee-wen Yen, National Taiwan University of Science and Technology
Chih-Ming Chen, National Chung Hsing University
Chao-hong Wang, National Chung Chung University
Ming-Tzer Lin, National Chung Hsing University
A.S.Md Abdul Haseeb, Bangladesh University of Engineering and Technology (BUET)
Ping-Chuan Wang, Suny New Paltz
Yu-An Shen, Feng Chia University
Jhe-Yu Lin, National Taipei University of Technology
Hiroaki Tatsumi, The University of Osaka
Xin Fu Tan, University of Queensland
Roland Brunner, Materials Center Leoben Forschung Gmbh
Scope Phases play a crucial role in determining a material’s properties. The manipulation of phase transformations provides a highly effective route to designing material microstructures optimized for specific needs. This is the 26th in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. It aims at microelectronic technologies to advanced energy technologies, including electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials, energy storage and generating materials.

Topics of interest include, but are not limited to:
1. Phase stability, transformation, formation, and morphological evolution of electronic packaging materials (such as Pb-free solders, low-temperature solder, thermal interface material (TIM), Cu-to-Cu bonding materials, transient liquid phase bonding, etc).
2. Phase stability, transformation, formation, and morphological evolution of advanced energy technologies (such as cathode and anode materials in battery, solid-state electrolyte, etc).
3. Understanding microstructure evolution under external field and its underlying mechanism. This includes electromigration, thermomigration, stress-migration, etc.
4. Advanced characterization and modeling methods as applied to phase stability, transformation, and formation.

Abstracts Due 07/15/2026
Proceedings Plan Planned:

PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE


A strain-driven compositional detour in an in situ TCP precipitation
Autonomous assessment of phase formation using the AlloyBot self-driving laboratory
Bonding ability of direct Ag nanostructures formed by metal-organic decomposition
Concentrated Sliding Friction Strengthened Dissimilar Stainless Steel/Ti Interface via Phase Transformation During Ultrasonic Spot Welding
Design and development of the multi-functional Ni-Mn-Ga composites for energy conversion
Diffusion Investigation in Cu-Co System
Effect of Annealing on Microstructure in a Zr-Based Thin-Film Metallic Glass Diffusion Barrier and Interfacial Reactions during Cu/Sn/Cu Thermocompression Bonding
Effects of Bi Additions on the Characteristics of Sn-In Solder
Electrostatic Assembly of Silver Micro/Nano Hybrids for Low Temperature Die Attach Sintering below 200 °C
Enhanced Corrosion Resistance and Reliability of Coated Copper Wire Bonding in Automotive Electronics via Interface Engineering
Enhanced Energy Storage Performance via Machine Learning Defined Phase Formation-Property Relationships in Multi-component Alloys
How to design high-strength Sn-In solders using CALPHAD and machine learning approach
In-Situ Investigation of Tensile Behavior and Creep Response in Sn–Bi-Sb Low-Temperature Solders
Interlayer-driven interfacial phase transformations during ultrasonic welding of titanium
Investigation of interfacial Reactions between Sn-xZn Solder and Cu-4.3 at.%Ti Alloy(C1990HP)
Investigation of Liquid/Solid Interfacial Reactions in the Sn-9Zn/Fe-xNi Couples
Machine Learning-Based Analysis of Residual Stress States in Nanocrystalline Thin Films
Mechanisms of Indium Addition in Modulating Interfacial Reactions and Enhancing the Mechanical Properties of Solder Joints
Microstructure-Dependent Crack Evolution and Creep Response of Sb-added Sn–Bi Low-Temperature Solders
Microstructure-Dependent Current Transport and Joule Heating in Ag Nanowire Networks under Electric Field
Microstructure Evolution of Cu Interconnects under Electromigration: Implications for Hybrid Bonding in Advanced 3D Chip Integration
Nanostructural Characterization for the Interface of Cu Metallized Glass Substrate Prepared via the TORIZING Process
Phase diagrams and interfacial reactions of Co-Ni-Ge ternary system
Phase equilibria of Ni-Ge-Sb and Cu-Ni-Ge ternary systems
Solid-State Interfacial Reactions and Intermetallic Compound Growth Kinetics in Sn-Ag Solder/Fe-Ni Under-Bump Metallization Systems
Structural and Phase Stability of Interpenetrating Ag Nano-Islands in Nafion Soft Actuators
The Influence of Undercooling on β-Sn Nucleation and Crystallographic Selection in Near-Eutectic Sn–58Bi Solder
Thermal Shock Reliability Evaluation of Ag-Al Paste Joints in SiC Power Modules


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