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About this Symposium

Meeting 2026 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
Sponsorship TMS Functional Materials Division
TMS: Alloy Phases Committee
Organizer(s) Yu-Chen Liu, National Cheng Kung University
Hiroshi Nishikawa, Osaka University
Shih-kang Lin, National Cheng Kung University
Yee-wen Yen, National Taiwan University of Science and Technology
Chih-Ming Chen, National Chung Hsing University
Chao-hong Wang, National Chung Chung University
Jaeho Lee, Hongik University
Ming-Tzer Lin, National Chung Hsing University
A.S.Md Abdul Haseeb, Bangladesh University of Engineering and Technology (BUET)
Ping-Chuan Wang, Suny New Paltz
Yu-An Shen, Feng Chia University
Ligang Zhang, Central South University
Jheyu Lin, National Taipei University of Technology
Hiroaki Tatsumi, The University of Osaka
Xin Fu Tan, University of Queensland
Scope Phases play a crucial role in determining a material’s properties. The manipulation of phase transformations provides a highly effective route to designing material microstructures optimized for specific needs. This is the 25th in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. It aims at microelectronic technologies to advanced energy technologies, including electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials, energy storage and generating materials.

Topics of interest include, but are not limited to:

  • Phase stability, transformation, formation, and morphological evolution of electronic packaging materials (such as Pb-free solders, low-temperature solder, thermal interface material (TIM), Cu-to-Cu bonding materials, transient liquid phase bonding, etc).
  • Phase stability, transformation, formation, and morphological evolution of advanced energy technologies (such as cathode and anode materials in battery, solid-state electrolyte, etc).
  • Understanding microstructure evolution under external field and its underlying mechanism. This includes electromigration, thermomigration, stress-migration, etc.
  • Advanced characterization and modeling methods as applied to phase stability, transformation, and formation.
Abstracts Due 07/01/2025
Proceedings Plan Undecided

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