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About this Symposium

Meeting 2026 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXV
Sponsorship TMS Functional Materials Division
TMS: Alloy Phases Committee
Organizer(s) Yu-Chen Liu, National Cheng Kung University
Hiroshi Nishikawa, Osaka University
Shih-kang Lin, National Cheng Kung University
Yee-wen Yen, National Taiwan University of Science and Technology
Chih-Ming Chen, National Chung Hsing University
Chao-hong Wang, National Chung Chung University
Jaeho Lee, Hongik University
Ming-Tzer Lin, National Chung Hsing University
A.S.Md Abdul Haseeb, Bangladesh University of Engineering and Technology (BUET)
Ping-Chuan Wang, Suny New Paltz
Yu-An Shen, Feng Chia University
Ligang Zhang, Central South University
Jhe-Yu Lin, National Taipei University of Technology
Hiroaki Tatsumi, The University of Osaka
Xin Fu Tan, University of Queensland
Scope Phases play a crucial role in determining a material’s properties. The manipulation of phase transformations provides a highly effective route to designing material microstructures optimized for specific needs. This is the 25th in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. It aims at microelectronic technologies to advanced energy technologies, including electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials, energy storage and generating materials.

Topics of interest include, but are not limited to:

  • Phase stability, transformation, formation, and morphological evolution of electronic packaging materials (such as Pb-free solders, low-temperature solder, thermal interface material (TIM), Cu-to-Cu bonding materials, transient liquid phase bonding, etc).
  • Phase stability, transformation, formation, and morphological evolution of advanced energy technologies (such as cathode and anode materials in battery, solid-state electrolyte, etc).
  • Understanding microstructure evolution under external field and its underlying mechanism. This includes electromigration, thermomigration, stress-migration, etc.
  • Advanced characterization and modeling methods as applied to phase stability, transformation, and formation.
Abstracts Due 07/29/2025
Proceedings Plan Planned:

PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE



An Improved Bonding Interface in Ultrasonic Welding of Stainless Steel via Introduction of Dynamic Recrystallization Interlayers
Bismuth-Induced Microstructural and Property Changes in Eutectic Sn-Zn Alloy for Soldering Application
CALPHAD-Assessment of Bi-Cu-Sn and Bi-Cu-Te Ternary Systems
Cu Migration and Whisker Formation in Cu₃Sn Intermetallics Under High Temperature and Current Stress
Design Sn-In-Based Alloys by Using Machine Learning Method
Development of a Transient Liquid Phase Soldering Process by Controlling Intermetallic Growth and Phase Transformations: Overview
Development of Low-Temperature Sn-Bi Alloys Using Sequential Electrodeposition
Effect of Bi Contents on Mechanical Properties of Sn-Bi-Zn-In Alloy
Effects of Au and In on Microstructural Evolution of Bi-based Solders
Effects of ENEPIG Surface Finish on Soldering With Sn52In
Effects of Minor Ga Addition to Sn and SnAgCu Solders on the Microstructure Evolution of Solder Joints
Efficient Interfacial Sinter Bonding of Ag to Semiconductor Substrates via Current-Induced Electric Fields
Electrochemical Co-Deposition of Copper-Silver Foil for Copper-Copper Thermocompression Bonding
Energy-Dependent Microstructural Evolution and Corresponding Mechanical and Electrical Properties in Ultrasonic Spot-Welded Ni/Al Lamellar Composite for Battery Tab Applications
Enhancement of the Magnetostrain via Manipulation of the Ni-Mn-Ga Martensite Phase Stability
Evaluations of TiN/Si3N4 Interface Structure Using TEM and DFT Analyses
Fine-Grained Cu for Cu Hybrid Bonding in 3D IC Integration
How to Design Sn-In-X low-Temperature Solder With High Strength
How to Design Zn-Ag Alloy for High-Performance Aqueous Zinc-Ion Batteries
Indentation-Based Insights Into the Mechanical Reliability of Silicon for High-Temperature Microelectronic Applications
Influence of Minor Elements on the Interfacial Reactions Between Sn-based Solder and Cu
Interfacial Reactions between Ga-Added Lead-Free Solder and Cu Substrate
Interfacial Reactions in the Cu/Sn/Ni Sandwich Couples in 3D IC Packaging
Interfacial Reactions of Sn-3.0Ag-0.5Cu (SAC) Solder With the Ni-xPd Alloys
Investigation of Bonding Strength in Cu/Sn/Cu Thermocompression Using a Bi-Layer Diffusion Barrier of Zr-Based Thin Film Metallic Glass
Investigation of Ga Addition on the Microstructural Evolution Between BiIn and Cu
Investigation of Interfacial Reactions of Sn-xZn Solders With Cu-2.3 wt.% Fe (C194) Substrate at 270oC
Martensitic α' Lath Width Effect on Fracture Elongation in EBW of Ti-6Al-4V Wrought-to-Additive Manufacturing Dissimilar Joints
Mesoscale Insights into Crack and Phase Transformation Coupling in Cubic Li7La3Zr2O12
Modeling Yield Strength of 7-Series Aluminum Alloys: Combining Machine Learning and Physics-Based Methods
Multiple Reflow Cycles between Sn solder and Cu-Fe Alloy (C194)
Nanograined Multi-Phase Gallium Nitride Through Ultrafast Melt-Quenching: Formation Mechanism and Ultralow Lattice Thermal Conductivity
Ni-Ga and Cu-Ga Compounds Growth During Solid-Liquid and Solid-Solid Reactions
Phase Equilibria of Co-Ge-Sb and Co-Ni-Ge Ternary Systems
Phase Transformation-Driven Interface Evolution and Bonding Mechanisms in Lamellar Ti/Ni/Ti Ultrasonic Welds
Phase Transformation-Enhanced Ultrasonic Welding of Pure Titanium: Strategic Interlayer Selection for Temperature-Dependent Applications
Phonons and Vibrational Entropy of Amorphous Silicon
Physically Interpreted Machine Learning Predictions of Yield Strength in 7xxx Aluminum Alloys
Polar Nanoregion Fluctuations and Phasons in Strong Pockels Material Strontium Barium Niobate
Structural Evolution of Cu6Sn5 Under Electric Current Stressing
Structure Analysis of Sn-Containing Intermetallic Phases
Study on Electrodeposited Sn/Bi Bilayers for Low-Temperature Soldering
The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn-Bi Alloys
The Interfacial Properties of Indium Thermal Interface Materials
Thermomigration of Sn-Based Solder Joints With Multi-Element Alloy Diffusion Barriers
Ultrasonic Welding of Ni-Plated CoFeMnNi High-Entropy Alloy: Bonding Behavior of CoFeMnNi/Ni/CoFeMnNi Interface and Mechanical Performance Analysis
Unveiling Real-Space Topological Textures and Their Phase Transitions in Using Multi-Modal Electron Microscopy
Utilizing Advanced Microscopy and CALPHAD-Based Modeling to Investigate Phase Stability and Transformation Kinetics in Mg–Zn–Y–Zr–RE and Mg–Zn–Y–Mn Alloys
Zn-Ag Alloy Enabling High-Performance Aqueous Zinc Ion Batteries


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