| Scope |
This symposium seeks to advance field-assisted materials processing, where electric, magnetic, acoustic, electromagnetic (microwave/RF), photonic (laser/flash), particle-beam (electron/ion), plasma, electrochemical, mechanical/vibrational, gravitational/centrifugal, thermal, and pressure fields (alone or coupled) modify transport, phase transformations, interfacial chemistry, and deformation pathways. Emphasis will be placed on metals and ceramics across powder consolidation (SPS/FAST, flash and cold/solvent-assisted sintering, ultrafast thermal/Joule and microwave sintering), melt processing and solidification (magnetic damping/stirring, ultrasonic cavitation, electromagnetic flow control, texture control), and field-enabled joining and shaping (electroplasticity, vibration-assisted forming, plasma/electrochemical surface activation). Contributions are sought that elucidate mechanisms (thermal vs. athermal effects, defect chemistry, electromigration, magnetohydrodynamics, irradiation/plasma effects), deliver validated multiphysics and data-driven models, and link field parameters to microstructure and properties. The symposium will highlight in situ diagnostics, control strategies, and scalable, energy efficient manufacturing pathways, including field-assisted additive manufacturing.
Typical topics include but are not limited to:
• Electric-field-assisted densification: SPS/FAST, flash sintering, field/current path effects, stability and uniformity
• Pressure/stress-assisted consolidation: hot pressing/HIP, pressure-enabled flash, creep and diffusion under load
• Thermal-field engineering: ultrafast heating/quenching, thermal gradients, transient thermal processing and kinetics
• Electromagnetic (microwave/RF/induction) processing: volumetric coupling, selective heating, scale-up and modeling
• Magnetic-field-assisted melts and solids: convection control, segregation suppression, texture/orientation control
• Acoustic/ultrasonic assistance: cavitation-driven nucleation/refinement, degassing, rheology and particle manipulation
• Photonic/laser-field assistance: laser/flash lamp processing, surface melting, localized sintering, heat-source design
• Particle-beam (electron/ion) assistance: beam heating, irradiation-enhanced diffusion/phase stability, defect engineering
• Plasma-assisted processing: plasma sintering/surface activation, nitriding/carburizing, interfacial chemistry control
• Electrochemical + gravitational/centrifugal fields: potential-driven transport/coatings, centrifugal casting, gradient formation and separation |