About this Symposium |
| Meeting |
2027 TMS Annual Meeting & Exhibition
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| Symposium
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Microstructure-Sensitive Design and Advanced Characterization: An MPMD/SMD Symposium Honoring David T. Fullwood
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| Sponsorship |
TMS Materials Processing and Manufacturing Division
TMS Structural Materials Division
TMS: Advanced Characterization, Testing, and Simulation Committee
TMS: Computational Materials Science and Engineering Committee
TMS: Mechanical Behavior of Materials Committee
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| Organizer(s) |
Oliver Johnson, Brigham Young University
Eric R. Homer, Brigham Young University
Michael P. Miles, Brigham Young University
Stephen R. Niezgoda, Ohio State University
Marko Knezevic, University of New Hampshire
Josh Kacher, Georgia Institute of Technology
Tim Ruggles, Sandia National Laboratories |
| Scope |
This symposium honors the significant and wide-ranging contributions of Professor David T. Fullwood that have left a lasting impact on research and education. His career has been marked by a strong focus on using advanced characterization techniques and modeling to understand the link between a material's microstructure and its mechanical behavior. These techniques have facilitated significant contributions in the areas of microstructure-sensitive design, and the application of novel electron microscopy techniques.
The symposium welcomes contributions that reflect the broad scope of his research, including but not limited to:
● Microstructure-Sensitive Design (MSD): The use of analytical and computational methods to understand and design materials with specific properties and performance, particularly those involving statistical descriptions of microstructure. Presentations on novel statistical descriptions of microstructure themselves are also of interest.
● Advanced Characterization Techniques: Research utilizing electron-based techniques such as Electron Backscatter Diffraction (EBSD) and High-Resolution EBSD (HR-EBSD) to quantify and model deformation, dislocation accumulation, and twinning.
● Computational and Experimental Mechanics: Work that integrates computational materials modeling (e.g. crystal plasticity, atomistic simulations) with experimental validation to understand the mechanical behavior of materials.
● Multiscale Analysis of Deformation: Studies that bridge different length scales to understand how behavior at the atomic and microstructural level influences macroscopic properties like ductility and fracture.
Special consideration will be given to submissions that reflect Professor Fullwood's contributions as a foundation for our technical understanding and ongoing developments in these areas. |
| Abstracts Due |
07/01/2026 |
| Proceedings Plan |
Undecided |