About this Abstract |
| Meeting |
2025 AWS Professional Program
|
| Symposium
|
2025 AWS Professional Program
|
| Presentation Title |
Evaluation of Ductility Dip Cracking Susceptibility in Weldments of Additively Manufactured Cu-Ni Alloys |
| Author(s) |
Seth E. Hixson, Boian Alexandrov, Dennis Harwig, Jennifer Semple |
| On-Site Speaker (Planned) |
Seth E. Hixson |
| Abstract Scope |
Abstract pending public release |
| Proceedings Inclusion? |
Undecided |