About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Fabricate Scaffold Cu6Sn5 Structure In Sn Joint By Cu(Sn-Cu) Nanoparticles-Contained Sn Powder |
| Author(s) |
Wei Chieh Huang, Cheng Yi Liu |
| On-Site Speaker (Planned) |
Wei Chieh Huang |
| Abstract Scope |
With the advancement of 5G technology, semiconductor devices are progressively evolving toward high-power applications. However, a major challenge associated with these high-power semiconductors is ensuring their long-term reliability. Two critical issues often arise: (1) local heat accumulation may lead to solder joint melting, and (2) during 3D packaging processes, repeated reflow cycles can cause remelting of the solder joints.
To address these challenges, this project proposes the development of solder joints reinforced with a three-dimensional (3D) scaffold structure composed of the Cu₆Sn₅ intermetallic compound. The inherently high melting point of Cu₆Sn₅ can significantly enhance the thermal stability and reliability of the solder joints. Moreover, the 3D scaffold structure provides robust mechanical support, effectively preventing solder joint collapse or slumping under high-temperature conditions. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Composites, High-Temperature Materials, Joining |