About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Physical Thermo-Mechanical Simulation: Laboratory Advances and In-Situ Diffraction Methods
|
| Presentation Title |
Pairing Hot Ductility Characterization with Weld Plate Residual Stress Evaluation for Cu-Ni Ductility Dip Cracking |
| Author(s) |
Matthew Caruso, Jeffrey Bunn, Andrew Payzant, Lesley D. Frame |
| On-Site Speaker (Planned) |
Lesley D. Frame |
| Abstract Scope |
Copper-nickel alloys exhibit a drastic dip in their ductility at intermediate temperatures leading to high risk of cracking during thermal cycling in welding or additive manufacturing. The so-called ductility dip cracking is often characterized using hot ductility tests at various strain rates and through controlled welding experiments. The current study considers residual stress mapping on welded C71500 Cu-Ni plates using neutron diffraction at the High Flux Isotope Reactor on the HIDRA beamline at Oak Ridge National Laboratory along with hot ductility testing performed on a GleebleTM 3500 thermophysical simulator. Results indicate that interpass temperature, plate thickness, and welded assembly fit-up (specifically tack welding of the backing bar) each have significant impact on residual stress distribution and magnitude in the welds. In addition, the strain present in the critical ductility dip temperature range could be controlled with weld parameter optimization. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Mechanical Properties, Joining |