About this Abstract |
| Meeting |
2026 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2026)
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| Symposium
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2026 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2026)
|
| Presentation Title |
Investigation of Reduced-Order Temperature Models for Warpage Prediction in Composites Additive Manufacturing |
| Author(s) |
Ethan Q. Kessel, Eduardo Barocio |
| On-Site Speaker (Planned) |
Ethan Q. Kessel |
| Abstract Scope |
Fiber-reinforced polymers printed via Material Extrusion additive manufacturing experience residual stresses and warpage due to thermal gradients and anisotropic phenomena of the composite material. Warpage can be effectively predicted using FEA, however the detailed thermal histories required are expensive to compute using full-3D transient heat transfer. We investigated the use of a reduced-order heat transfer model to cut the computation time needed for temperature predictions from hours to minutes. The temperature predictions from the reduced heat transfer model were mapped onto 3D geometry used in a thermomechanical analysis of the print process. Temperature predictions, residual stress, and warpage are compared for geometries prone to deformation for both computational methods. This presentation discusses the computation savings, accuracy, and limitations of the reduced-order method against a full-3D thermomechanical analysis. |
| Proceedings Inclusion? |
Undecided |