About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Printed Electronics and Additive Manufacturing of Advanced Functional Materials and Devices—From Processing Concepts to Applications
|
| Presentation Title |
Printable Copper Materials for Flexible Hybrid Electronics |
| Author(s) |
Shenqiang Ren |
| On-Site Speaker (Planned) |
Shenqiang Ren |
| Abstract Scope |
Printable metallic conductors, coupled with robust mechanical and thermal stability, exhibit potential for additive manufacturing in radiofrequency electronics. However, their electrical conductivity is indispensable for realizing their potential in microwave communication, particularly considering the essential aspect of miniaturization in microwave applications. Coupled with additive manufacturing, molecular decomposition metals overcome the limitations of traditional material-limited and thermally initiated metalworking, facilitating high-throughput and rapid prototyping of stoichiometry and composition-controlled metals. Here, we describe a new paradigm for the design and additive manufacturing of metallic conductor materials by printing molecular decomposable materials. These materials are capable of withstanding thermo-mechanical loading and operating in extreme static and dynamic conditions. Our findings can be extended to other printable molecular decomposable materials, establishing a platform for rapid prototyping of high-temperature electronics suitable for harsh environments. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Electronic Materials, High-Temperature Materials |