About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Electromigration Behavior and Dynamic Mechanical Response of Indium-Modified Sn/Ag/Cu Solder Joints. |
| Author(s) |
Mohd Arif Anuar Mohd Salleh |
| On-Site Speaker (Planned) |
Mohd Arif Anuar Mohd Salleh |
| Abstract Scope |
This study investigates the effects of electromigration and dynamic mechanical behavior in In-Sn-Ag lead-free solder joints for high-current and high-temperature electronic packaging applications. Solder joints under electrical stressing experience accelerated atomic diffusion, intermetallic compound (IMC) growth, microstructural degradation, and reduced mechanical reliability. To improve understanding of these effects, indium (In) was added to the Sn-Ag-Cu solder system at 0–15 wt.%. The influence of In on phase formation, IMC evolution, elemental redistribution, and microstructural stability was evaluated under electromigration conditions. Electromigration analysis examined current-induced diffusion, anode-cathode asymmetry, IMC growth, and potential damage formation within the joints. Dynamic Mechanical Analysis (DMA) was used to determine storage modulus, loss modulus, and damping factor, providing insight into the stiffness, energy dissipation capability, and mechanical stability of the solder alloys under dynamic loading. The findings contribute to the development of more reliable lead-free solder joints for advanced electronic packaging. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Mechanical Properties, Joining, |