About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Enhanced Ag Nanopaste Bonding with Cu Surface Pre-Treatment of Self-Assembled Monolayers |
| Author(s) |
Hsin-Yu Hou, Fan-Yi Ouyang |
| On-Site Speaker (Planned) |
Hsin-Yu Hou |
| Abstract Scope |
Ag nanopaste is a promising material for flexible electronics packaging due to its superior thermal and electrical properties. A low-temperature Cu bonding process using Ag nanopaste has been developed to reduce chip damage and manufacturing costs. However, Cu’s high oxidation tendency necessitates bonding in vacuum or with surface passivation to prevent oxide formation, which critically impacts bond quality. Self-assembled monolayers (SAMs), particularly those derived from thiol compounds, offer a potential solution for effective Cu passivation. This study investigates the influence of thiol-based SAMs on Cu surfaces to improve bonding with Ag nanopaste. The treated samples were characterized in terms of surface morphology, elemental composition, and electrical properties. The effects of SAM passivation on the interfacial microstructure and shear strength of bonded joints were systematically analyzed. The findings highlight the potential of SAM treatment to enable low-temperature, high-reliability Cu–Ag bonding for next-generation flexible electronics applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Joining, Surface Modification and Coatings |