About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
3D X-ray Imaging and Defect Detection for Various Interconnects in Advanced Packaging |
| Author(s) |
Chuyuan Zheng, Vikaram Singh, Anasuya Adibhatla, Tianzhu Qin, Doug J Rowland, Jeff Gelb |
| On-Site Speaker (Planned) |
Chuyuan Zheng |
| Abstract Scope |
With recent advances in semiconductor fabrication, advanced packaging has become one of the most important steps in the process. With layers of metal interconnects multiplies in the package, characterization of the metal joints and its defects are significantly more difficult to detect using conventional optical techniques. X-ray computed tomography has seen rapid growth being applied to package inspections, but the throughput remains the roadblock from in-line or near end of line applications. Here we introduce our patented 3D X-ray systems that performs high-throughput and high quality scans on wafers, CoWoS and packages, which can be used in both in-line and failure analysis environments. The system achieves a full edge-to-edge coverage of a 300-mm wafer with spatial resolution < 0.3 mm, or a high-throughput, low-dose scan up to ~2 minutes. With in-house developed AI imaging enhancement and analysis toolkits one can perform accurate real metrology inspections in 3D space. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Electronic Materials, Characterization, Machine Learning |