About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
A Three-Step Simultaneous Cutting & Chamfering (Dicing) Ultrafast-Laser Process for Reliable Singulation of Thin Amorphous Glass Disks: The Role of Wafer-Grade Vacuum Chucking and Direct-Drive Rotary Motion |
| Author(s) |
Yi-Wun Wang, Song Jhe Liu, Chii-Dong Ho |
| On-Site Speaker (Planned) |
Song Jhe Liu |
| Abstract Scope |
Thin amorphous glass is increasingly adopted for next-generation data-storage media and glass-core advanced packaging, but its brittleness makes reliable edge formation the key yield-limiting step. We report a three-step ultrafast-laser process that simultaneously cuts and chamfers (dicing) thin glass disks: bottom chamfer, full-thickness Bessel-beam vertical cut, then top chamfer, completing singulation on a single platform without re-fixturing. Process reliability is governed primarily by hardware and operating procedure: a custom semiconductor-wafer-grade vacuum-chuck fixture holds the disk flat, while a direct-drive (DD) motor rotary axis delivers concentric, repeatable ID/OD contours. Controlling the processing sequence and confining laser energy within the chamfer boundary substantially suppresses inner cracking, supported by a three-category defect-classification framework used for acceptance and quality control. A dimensionless damage-index criterion is referenced only to guide parameter selection. The Bessel-cut sidewall reaches Sa = 0.36 micrometers; after polishing, edge strength improves up to 137% and edges pass 50-drop impact testing. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |