About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Interfacial Stability and Reliability of Sn–3.5Ag Solder Joints with FeCoNiMn Diffusion Barriers |
| Author(s) |
Yu-An Shen, Tzu-Hsiang Liao |
| On-Site Speaker (Planned) |
Yu-An Shen |
| Abstract Scope |
Advanced electronic packaging requires reliable diffusion barriers to control interfacial reactions during soldering, reflow, and thermal aging. In this study, FeCoNiMn high-entropy alloy was evaluated as a diffusion barrier for Sn–3.5Ag solder joints in symmetric FeCoNiMn/Sn–3.5Ag/FeCoNiMn and asymmetric FeCoNiMn/Sn–3.5Ag/Cu structures. FeCoNiMn showed good solderability and effectively suppressed excessive interfacial reaction compared with Cu metallization. In the symmetric structure, a thin and stable (Fe, Co, Ni, Mn)Sn₂ intermetallic layer formed and remained relatively planar after reflow and aging, supporting good mechanical reliability. In the asymmetric structure, Cu dissolution modified the reaction pathway and induced a Cu-rich M₆Sn₅ layer near the FeCoNiMn side, together with an Fe-rich MSn₂ layer adjacent to FeCoNiMn. Aging further confirmed that MSn₂ limited excessive interfacial growth. These findings demonstrate that FeCoNiMn can improve the interfacial stability and reliability of Sn–Ag solder joints for advanced packaging. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Thin Films and Interfaces, Joining, Electronic Materials |