|About this Abstract
||Materials Science & Technology 2019
||Failure Analysis: Industry Specific Failures
||Adhesive-wood Interactions in Relation to Failure in Bonded Wood Products from Centimeter to Nanometer Scale
||Charles R. Frihart, Nayomi Plaza, Christopher Hunt, Joseph Jakes
|On-Site Speaker (Planned)
||Charles R. Frihart
Most wood products use adhesives to maximize resource utilization and minimize costs. However, wood is particularly difficult to bond efficiently because of its porosity, composite nature, and anisotropy. Most adhesives form good wood bonds, but few bonds hold up to the dimensional changes caused by changes in the wood’s moisture content. Although durable adhesives exist, adhesive costs are large and more environmentally-friendly adhesives are desired. However, the complexity of adhesive-wood interactions across length scales hinders efforts. Our work involves applying new tools based on synchrotron x-ray and neutron scattering methods to study the interactions of adhesives with wood across several length scales (from centimeter to nanometer) to better understand the where and why of bond failure. Newer characterization techniques used in our multi-scale studies approach include: x-ray and neutron scattering based methods such as x-ray fluorescence and x-ray computed tomography as well as small angle neutron scattering.