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About this Abstract
Meeting 2026 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2026)
Symposium 2026 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2026)
Presentation Title Thermal Simulation of WAAM Inconel 718 for Heat Accumulation and Process Stability
Author(s) Anamol Thapa, Mathew Farias, Ben Xu
On-Site Speaker (Planned) Ben Xu
Abstract Scope Wire arc additive manufacturing (WAAM) is useful for producing large metallic components, but repeated heating and cooling can lead to heat accumulation, uneven thermal history, residual stress, and distortion. This study develops a three-dimensional finite element thermal model for WAAM of Inconel 718 (IN718). A moving heat source and temperature-dependent material properties are used to simulate multilayer deposition. The effects of travel speed, heat input, and interlayer dwell time are evaluated through peak temperature, interpass temperature, cooling rate, and thermal gradient. These thermal responses are discussed in relation to process stability and distortion risk. The study provides a practical simulation framework for understanding how WAAM parameters influence thermal history during IN718 deposition and can support improved parameter selection for more stable WAAM fabrication.
Proceedings Inclusion? Planned: Post-meeting proceedings

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