About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
|
| Presentation Title |
Microstructure Evolution of Cu Interconnects under Electromigration: Implications for Hybrid Bonding in Advanced 3D Chip Integration |
| Author(s) |
Junghyun Cho |
| On-Site Speaker (Planned) |
Junghyun Cho |
| Abstract Scope |
The continued scaling of heterogeneous integration for artificial intelligence (AI) and high-performance computing has accelerated the adoption of Cu–Cu hybrid bonding for advanced three-dimensional (3D) chip integration. As Cu interconnect dimensions continue to shrink into the sub-micron regime, increasing current density and microstructure variability at bonded interfaces pose a significant reliability concern due to electromigration. To address this challenge, we investigated the mechanisms governing microstructure evolution, including grain growth, crystallographic texture development, void formation, Cu extrusion, and interfacial degradation in bonded Cu interconnects under high-current and elevated temperature conditions. Microstructure developments were evaluated through electron backscatter diffraction (EBSD), high-resolution focused ion beam (FIB) 3D tomography, and electromigration testing to establish process–microstructure–reliability relationships. In addition, microstructure engineering strategies and opportunities for in-situ synchrotron characterization of Cu microstructure evolution in fine-pitch hybrid bonding interconnects are highlighted. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Electronic Materials, Joining |