About this Abstract |
Meeting |
2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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Symposium
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2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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Presentation Title |
Bonding Integrity and Crack Susceptibility of Pure Copper/17-4PH Bimetallic Structures Fabricated by Powder Bed Fusion |
Author(s) |
Seung Weon Yang, Hyub Lee, Sohn Il, Du-Rim Eo |
On-Site Speaker (Planned) |
Seung Weon Yang |
Abstract Scope |
This study investigates deposition characteristics and cracking behavior of pure copper/17-4PH (precipitation hardening stainless steel) bimetallic structures fabricated by powder bed fusion (PBF). Copper’s high reflectivity (>95% at 1064 nm) and thermal conductivity hinder bonding with 17-4PH. PBF’s small beam size and high intensity minimize heat loss, enhancing copper melting. 17-4PH was deposited on pure copper substrates, with characteristics analyzed under various conditions. Stable deposition without defects occurred at low energy density (≤0.15 J/mm). Intermediate energy density (0.17–0.44 J/mm) caused deposition cracks, while high energy density (≥0.5 J/mm) induced deposition and edge cracks due to residual stress. Deposition cracks formed in the 13–34 wt% Cu region, driven by δ-Fe to γ-Fe transformation, wider solidification ranges, and insufficient liquid. Rapid cooling during PBF triggered liquid-phase separation, impacting hardness. Fracture in the mixed zone at high energy density reduced elongation. |
Proceedings Inclusion? |
Planned: Post-meeting proceedings |