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About this Abstract
Meeting 2026 TMS Annual Meeting & Exhibition
Symposium Thermodynamics and Kinetics of Alloys IV
Presentation Title Physics-based Thermal Conductivity Model Compatible with Multi-component CALPHAD Assessment
Author(s) Zhi Liang, Ursula R. Kattner, Matthew J. Luebbe, Fan Zhang
On-Site Speaker (Planned) Zhi Liang
Abstract Scope Thermal conductivity is a critical thermophysical property for materials used in semiconductor manufacturing applications such as wafer tables and packaging substrates. However, reliable thermal conductivity models for complex multicomponent alloys still lacks, creating a challenge for reliable digital twins simulating thermal behavior in semiconductor manufacturing. In this work, we developed a physics-based model that links thermal conductivity to phase constitution and composition data provided by CALPHAD. This model has been validated in multiple unary and binary systems and predicts thermal conductivity across wide temperature and composition ranges by accounting for phase and composition effects. It is also readily applicable to multi-component systems. This approach enables improved design and qualification of advanced materials for thermal management. This work was performed with funding from the CHIPS Metrology Program, part of CHIPS for America, National Institute of Standards and Technology, U.S. Department of Commerce.
Proceedings Inclusion? Planned:
Keywords Computational Materials Science & Engineering, Modeling and Simulation,

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