About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Thermomechanical Design-Space Quantification of Direct Cu–Cu Bonded Interconnect Geometry and Population in 3D Stacked Dies |
| Author(s) |
Yong Jie Wong, Mohd Sharizal Abdul Aziz, C.Y. Khor, Mohammad Hafifi Hafiz Ishaik, Krishnamoorthy Ramalingam, Kim Hoey Yeoh, Shen Ang Chze, John Tan Teng Hwang |
| On-Site Speaker (Planned) |
Mohd Sharizal Abdul Aziz |
| Abstract Scope |
Direct Cu–Cu bonded integration is a key enabler for high-bandwidth and heterogeneous electronic systems. Its reliability design remains challenging because interconnect geometry and population alter thermomechanical constraint across different structural scales. This work establishes a validated transient thermal–structural framework for Cu–Cu bonded stacked dies under JEDEC-aligned thermal cycling. The study examines pillar height, diameter, pitch and interconnect density as controllable design variables. Instead of treating each variable as an isolated geometric adjustment, the framework interprets them through compliance, stiffness, spacing-mediated constraint and population burden. This enables a reliability-informed design window to be identified without relying on geometric maximization alone. The study supports parameter-specific optimization of Cu–Cu bonded interconnects and provides a scalable basis for translating thermomechanical simulation into practical design guidance for advanced 3D integration. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Modeling and Simulation, Mechanical Properties, Copper / Nickel / Cobalt |