About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Corrosion Effect Analysis of Heat Dissipation Components in AI Server Liquid Cooling Systems |
| Author(s) |
Po-Yu Chen, Cheng-Yi Liu |
| On-Site Speaker (Planned) |
Po-Yu Chen |
| Abstract Scope |
Microchannel cold plates with 25% propylene glycol (PG25) offer efficient cooling for high-performance AI chips with three-dimensional integrated circuits (3D ICs) package. The corrosion behavior of Cu–steel, Cu–Cu, and steel–steel joints in PG25 were investigated. Results show that Cu–steel and steel–steel joints exhibit higher corrosion resistance than Cu–Cu joints when welded with normal laser power. However, low laser power leads to insufficient penetration and the formation of Cu-rich/Fe-rich brittle phases, which induce pitting corrosion. Tafel extrapolation, PEIS, and XPS analyses confirmed the corrosion characteristics and identified corrosion products, while constant current tests simulated long-term service conditions. An electrochemical analysis procedure was established to evaluate the corrosion reliability of dissimilar metals in PG25, providing a design reference for future material and process optimization to enhance the stability and reliability of liquid-cooled AI server systems. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Electrometallurgy, Other |