About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Au–Au Bonded Microfluidic Cooling for High-Power Chiplet Packages |
| Author(s) |
Yuhao Lo, Jun Mizuno, Hsuan-hao Chang, Yu-ting Wu, Muhammad Firman Friyadi, Chi-Hua Yu, Wen-Chun Wu, Hung-Hsien Huang, Chen-Chao Wang, Chih-Pin Hun |
| On-Site Speaker (Planned) |
Yuhao Lo |
| Abstract Scope |
This study presents a high-performance microfluidic cold plate directly integrated above dual 400 W ASICs and HBM2E modules within advanced packaging. Two prototypes—Si–Si and Cu–Cu bonded microchannels—were fabricated using semiconductor and precision machining processes. Au–Au diffusion bonding was employed to ensure high-temperature compatibility and leak-free sealing. CFD simulations revealed superior thermal spreading in the Cu-based design. Initial experiments confirmed rapid central cooling and anisotropic temperature decay. Validation of the Si-based device is underway to complete the material-performance comparison. |
| Proceedings Inclusion? |
Planned: |