About this Abstract |
| Meeting |
2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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| Symposium
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2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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| Presentation Title |
Modeling and Simulation of Cold Spray Additive Manufacturing: Insights Into Metallic Particle Bonding |
| Author(s) |
Abishek Kafle, Kalen T. Baker, Ben Xu, Weihang Zhu |
| On-Site Speaker (Planned) |
Weihang Zhu |
| Abstract Scope |
Cold Spray Additive Manufacturing (CSAM) is emerging as a promising process to produce metal parts with low temperature distortion. However, the full understanding of particle-substrate interaction during deposition remains essential to facilitate process optimization. In the current research, a finite element simulation model embedded within ABAQUS is utilized to investigate the particle effect mechanism and bonding mechanism of CSAM with steel, aluminum, and copper as feedstock and substrate materials. The high-strain-rate deformation and thermal effects of particle impacts were simulated using Coupled Eulerian–Lagrangian (CEL) modeling. Temperature- and strain-rate-dependent material response was also used in the simulation to accurately represent solid-state bonding behavior. The simulations covered plastic deformation prediction, temperature rise, interfacial pressure, and mechanical interlocking degree in single-particle impacts. The outcome indicates that excellent CSAM bonding is characterized by high localized plastic deformation and average thermal softening along the particle–substrate interface. |
| Proceedings Inclusion? |
Planned: Post-meeting proceedings |