About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Microstructure-Sensitive Modeling Across Length Scales: An MPMD/SMD Symposium in Honor of David L. McDowell
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| Presentation Title |
Disconnection Mechanics: Segregation, Stability, and Mobility at Interfaces |
| Author(s) |
Remi Dingreville, Chongze Hu, Douglas Medlin |
| On-Site Speaker (Planned) |
Remi Dingreville |
| Abstract Scope |
This talk explores grain boundary disconnections—defects with both dislocation and step-like characteristics—and their critical role in binary alloys. I'll discuss how the local stress fields from these defects create distinct solute segregation patterns at grain boundaries. This relationship, confirmed by atomistic simulations and continuum mechanics, reveals a strong correlation between local pressure and segregation.
Using this knowledge, we developed interfacial defect diagrams to predict the stability and mobility of disconnections across a range of temperatures and solute concentrations. These diagrams highlight stability regimes governed by solute clustering and pinning, which significantly impact disconnection migration. SNL is managed and operated by NTESS under DOE NNSA contract DE-NA0003525. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Computational Materials Science & Engineering, Modeling and Simulation, |