About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Role of Ag additions on Microstructure, Phase Transformation and Thermal Reactions of In-35Sn Alloys |
| Author(s) |
Yi Pei Tan, Mohd Arif Anuar Mohd Salleh, Zaliman Sauli, Flora Somidin, Krongthong Kamonsuangkasem, Waraporn Tanthanuch, Hideki Nakajima, Kazuhiro Nogita |
| On-Site Speaker (Planned) |
Yi Pei Tan |
| Abstract Scope |
This study investigates the effects of minor Ag additions (1–3 wt%) on the microstructure, phase composition, and thermal behavior of an In-35Sn alloy for low-temperature solder applications. Characterization was carried out using FESEM, DSC, synchrotron XRD, µ-XRF, and synchrotron soft XPS. Microstructural analysis revealed the formation of AgIn₂ and refinement of γ-InSn₄ with increasing Ag content. Synchrotron XRD confirmed the presence of β-In₃Sn, γ-InSn₄, and AgIn₂ phases, suggesting Ag segregation at In sites. XPS analysis indicated In-Sn bonding and characteristic plasmon loss features. Thermal analysis showed reduced melting and cooling onset temperatures, as well as changes in pasty range and undercooling. These findings highlight the correlation between Ag addition, phase evolution, and thermal performance, offering insights for the development of improved In-Sn-Ag solder alloys for advanced electronic packaging. |
| Proceedings Inclusion? |
Planned: |