About this Abstract |
| Meeting |
MS&T25: Materials Science & Technology
|
| Symposium
|
Grain Boundaries, Interfaces, and Surfaces: Fundamental Structure-Property-Performance Relationships
|
| Presentation Title |
Preliminary Investigation of Metal-SiC Interface Behavior via Deposition of Mo and W for High-Temperature Applications |
| Author(s) |
Stan Watson TEAGHO VOUFO, David FIELD |
| On-Site Speaker (Planned) |
Stan Watson TEAGHO VOUFO |
| Abstract Scope |
Reliable ceramic-metal interfaces need development for structural and functional components that operate in extreme environments. This research investigates the initial stages of joining silicon carbide (SiC) with tungsten (W) and molybdenum (Mo) refractory metals through metal deposition. The research aims to study how the adhesion of W and Mo films to SiC substrates changes based on the deposition conditions. The research includes performing adhesion tests, including scratch tests at both room temperature and high temperatures, to evaluate interface strength. This paper presents basic methods to evaluate interface performance and the behavior of this kind of interface with temperature. The results will enable better development of ceramic-to-metal systems that function in harsh environmental conditions. |