About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Materials Aging and Compatibility: Experimental and Computational Approaches to Enable Lifetime Predictions
|
| Presentation Title |
H-30: Investigation Solder Joint Performance in Additively Manufactured Flex Cables With Silver Ink Pads |
| Author(s) |
Joshua Minster, Hannah Fowler, Emily Huntley, Aiden Hayes, Georgia Kaufman |
| On-Site Speaker (Planned) |
Joshua Minster |
| Abstract Scope |
The assembly of conventionally manufactured flex cables presents several challenges, including maintaining flexibility, adhering to thickness specifications, ensuring insulation resistance, and achieving acceptable solderability. This study investigates the solderability of novel additively manufactured flex cables, focusing on the solder joint characteristics between copper pins and inkjet-printed silver pads on a printed acrylate substrate. We focus on the solder joint characteristics between copper pins and inkjet-printed silver pads on a printed acrylate substrate, utilizing eutectic tin-lead and low-temperature lead-free solder alloys. Mechanical testing was conducted to characterize the properties of these joints. Understanding the behavior of solder joints is crucial for advancing additive manufacturing techniques in electronics. Our findings aim to address the current limitations in soldering to AM flex cables, thereby enhancing the reliability and performance of these assemblies within constrained manufacturing and operating temperature windows.
SNL is managed and operated by NTESS under DOE NNSA contract DE-NA0003525 |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Electronic Materials, Additive Manufacturing |