About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advances in Materials Deposition by Cold Spray and Related Technologies III
|
| Presentation Title |
Engineered interfacial melting in high-velocity microparticle impacts: A pathway to defect-free bonding of dissimilar materials |
| Author(s) |
Muhammad Shehryar Khan, Christopher A Schuh |
| On-Site Speaker (Planned) |
Muhammad Shehryar Khan |
| Abstract Scope |
Recent advances in microparticle impact studies have revealed that melting – which has been considered detrimental in high-velocity particle impacts – can in fact enable adhesion when the melt layer is sufficiently thin. In this talk, we present two complementary studies investigating the role of eutectic melting and nanoscale resolidification in cold spray and related impact-based deposition techniques. Using laser-induced particle impact testing to monitor AA7075 microparticle impacts across a wide velocity range, we demonstrate that eutectics can promote localized melting at surprisingly low velocities. Building on this, we show that by restricting the volume of melt generated during impact, resolidification becomes fast enough to support metallurgical bonding, even in the absence of extensive plastic deformation in the substrate. These findings offer a revised framework for adhesion mechanisms in cold spray, one in which the interfacial melt layer is not necessarily a defect but a tunable feature for joint formation. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Joining, Surface Modification and Coatings |