About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Characterization of Minerals, Metals and Materials 2026 - In-Situ Characterization Techniques
|
| Presentation Title |
Characterization of Electric Current-Induced Deformation in Cu6Sn5 Using Micropillar Compression |
| Author(s) |
Shubhayan Mukherjee, Yu-chen Liu, Shih-kang Lin |
| On-Site Speaker (Planned) |
Shubhayan Mukherjee |
| Abstract Scope |
The mechanical response of intermetallic compounds under electric current remains poorly understood, especially in systems exhibiting polymorphic phases. In this study, both low-temperature and high-temperature polymorphs of Cu6Sn5 were investigated under electric current stressing through micropillar compression. Single-grain pillars were fabricated using EBSD-guided FIB milling and compressed under identical load protocols with and without electric current. The presence of electric current resulted in a measurable change in yield stress and strain, indicating electric current-induced modification of plastic response. In-situ SEM revealed differences in slip activity depending on the applied current, and TEM analysis confirmed enhanced dislocation generation in electric current-stressed conditions. These results suggest that electric current modifies the local deformation mechanisms in Cu6Sn5 through strain and defect interactions, distinct from conventional thermal effects. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Electronic Materials, |