About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Printed Electronics and Additive Manufacturing of Advanced Functional Materials and Devices—From Processing Concepts to Applications
|
| Presentation Title |
Additive Manufacturing of P-N Junction Diodes on Silicon Wafer |
| Author(s) |
Steven Peeples |
| On-Site Speaker (Planned) |
Steven Peeples |
| Abstract Scope |
On-demand in-space manufacturing of semiconductor devices and electronics is essential for space exploration and commercialization to reduce mass to orbit and resupply time. Additive manufacturing technologies are promising candidates for directly printing such devices on demand. However, the limitations of current ink-based printing technologies, such as the complexity of ink formulations, contaminations, transportation, and storage challenges, have limited their use for in-space manufacturing applications. Here, the Laser Ablation and Sintering EnableD (LASED) dry multi-material printing technology is evaluated for the fabrication of P-N junction diodes on silicon wafer. The LASED printing technology enabled the on-demand generation of pure nanoparticles from solid targets and, subsequently, the real-time laser-sintering of conductive shapes without lithography or masks. Laser Induced Diffusion (LID) was accomplished with the same process to pattern and diffuse dopants to create N-type and P-type regions. The P-N junction diode fabrication strategy and current-voltage analysis are presented. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Electronic Materials, Thin Films and Interfaces |