About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
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Symposium
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Mechanical Response of Materials Investigated through Novel In-situ Experiments and Modeling
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Presentation Title |
Micro-shear of Silicon: Effects of Temperature and Crystal Orientation Analyzed Using In-situ Digital Image Correlation |
Author(s) |
Carmen Lauener, Fabian Schwarz, Laszlo Pethö, Johann Michler, Jeffrey M. Wheeler, Ralph Spolenak |
On-Site Speaker (Planned) |
Jeffrey M. Wheeler |
Abstract Scope |
Small volumes of silicon serve as both functional and structural components in microelectromechanical systems. Direct shear measurement of small volumes subjected to two equal but opposing forces is desirable to achieve a better understanding of silicon's behavior under complex loading. In the current work, we use the geometry proposed by Pfetzing-Micklich et al. to investigate the [-100](110) shear system in Silicon using high temperature, in-situ experiments in the SEM. Specimens are fabricated using a combined approach of lithographic etching and FIB milling. Since bending and deflection of the substrate material dominate the measured displacement at low temperatures, digital image correlation was applied to determine the actual strain distribution. Finally, the effect of temperature and orientation on shear strength is compared and discussed in terms of critical resolved shear stress values obtained from pillar compression experiments. |
Proceedings Inclusion? |
Planned: |
Keywords |
Characterization, Mechanical Properties, Modeling and Simulation |