About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Microstructure-Controlled Sn-In/Sn-Bi-Ag Composite Solders for Low-Temperature High-Toughness Packaging |
| Author(s) |
Yuncong Wang, Junjie Yuan, Kevin Nguyen, Zhihao Zhang, David P. Yan |
| On-Site Speaker (Planned) |
Yuncong Wang |
| Abstract Scope |
The development of lead-free solders that combine low processing temperature with sufficient mechanical reliability is essential for advanced electronic packaging. In this work, Sn-Bi-based low-temperature solder systems are explored with the aim of reducing their inherent brittleness through alloy and microstructure design. In and Ag additions are considered to modify phase formation, particularly the nucleation and spatial distribution of the Bi-rich phase. A composite solder concept is proposed in which Sn-Bi-Ag alloy powder is incorporated into a eutectic Sn-In matrix to promote a more discontinuous Bi-rich phase morphology and increase the contribution of the ductile Sn-In phase during deformation. Current experimental work is focused on evaluating the effects of compositional ratio on impact toughness, melting behavior, and microstructural evolution. This strategy is expected to provide a practical pathway for designing low-cost, high-toughness, low-temperature solder materials for next-generation packaging and heterogeneous integration. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Other, |